
Quantum Efficiency Tester
PL/EL Integrated System
PV-Reflectumeter
3D Confocal Microscope
In-Line Four Point Probe Tester
Four Point Probe Tester
In-Line Thin Film Thickness Tester
Raman Spectrometer
FTIR Spectrometer
Spectrophotometer
Automatic Spectroscopic Ellipsometer
Contact Resistance Tester
Ultra depth of field 3D microscope
Auto Visual Tester
VMM PV Vision Measuring Machine
Solar Cell Horizontal Tensile Tester
Steady State Solar Simulator for Solar Cell
Solar Cell UV Aging Test Chamber
Solar Cell Comprehensive Tensile Tester
Visual Inspection Tester
Wet Leakage Current Tester
PV Module EL Tester
PV Module UV Preconditioning Chamber
Steady State Solar Simulator for PV Module
Current Continuous Monitor
Potential Induced Degradation Test
Bypass Diode Tester
LeTID Test System
Reverse Current Overload Tester
Impulse Voltage Tester
Hipot Insulation Tester
Ground Continuity Tester
Hipot Insulation Ground Tester
Damp Heat Test Chamber
Humidity Freeze Test
Thermal Cycle Test Chamber
Dynamic Mechanical Load Tester
Static Mechanical Load Tester
Hail Impact Tester
Robustness of Termination Tester
Module Breakage Tester
Cut Susceptibility Tester
Peel Shear Strength Tester
Universal Testing Machine (Single-arm)
Universal Testing Machine (Double-arm)
Glass Transmittance Tester
Acetic Acid Test Chamber
EVA Degree of Crosslinking Test System
Junction Box Comprehensive Tester
Drop ball tester
Semi-automatic scanning four-probe tester
Stylus Profilometer
Maximum Power Point Tracker
Perovskite Glass Transmittance Tester
Perovskite P1 Laser Scribing Multifunctional Testing Machine
Perovskite Online PL Tester
Perovskite Online Sheet Resistance Tester
Online Perovskite Film Thickness Tester
Perovskite Process Inspection Workstation
Portable IV Curve Tester
Portable EL Tester
Portable Thermal Imaging Tester
Solar Module Multi-Channel Testing System
PV Inverter Power Quality Tester
Drone EL Tester
IV Tester
IVEL Cell Sorting Machine
Solar Cell Surface Morphology
Purpose of Cleaning & Texturing
After silicon wafer slicing, edge damage and disrupted crystal lattice structures lead to severe surface recombination. The cleaning & texturing process aims to remove surface defects, create pyramidal light-trapping structures to enhance light absorption, and improve minority carrier lifetime.
Related Products
Go to Product CenterFront Boron Diffusion Process
In TOPCon cell manufacturing, front boron diffusion is a critical step to form the p+ emitter, directly impacting PN junction quality, carrier transport efficiency, and overall cell performance.
The PN junction is essential for photovoltaic conversion. Under controlled concentration, temperature, pressure, and duration, P-type dopants are diffused into the N-type substrate to achieve optimal junction depth, doping concentration (ρ), and sheet resistance (R) for solar cells.
Related Products
Go to Product CenterBSG Removal & Alkaline Polishing
BSG removal and alkaline polishing in TOPCon are critical for passivation quality, low recombination, and contact performance.
During boron diffusion (e.g., for p+/BSF formation), amorphous BSG forms. Residual BSG ↑ SRV, ↓ passivation adhesion (e.g., Al₂O₃/SiNₓ), and ↑ Rc.
BSG removal preceeds alkaline polishing for damage removal. Combined processes (e.g., acid+alkaline) streamline production, boosting TOPCon Voc by 5-10 mV and η by 0.1–0.3%.
Related Products
Go to Product CenterTOPCon's core innovation is an ultra-thin oxide and doped poly-Si layer for superior passivation, reducing recombination and boosting efficiency. Key deposition methods are LPCVD (mainstream), PECVD, and PVD. Challenges include thickness/uniformity control and mitigating edge deposition.
Related Products
Go to Product CenterPSG Removal & RCA Cleaning
During diffusion, P₂O₅ from POCl₃ forms PSG (Phosphosilicate Glass) on wafer edges. PSG induces carrier leakage to the rear, reducing shunt resistance and increasing short-circuit risk.
To prevent carrier leakage and shorting, the rear and edge diffusion layers and PSG must be removed via single-side wet etching (liquid-carrying roller) for front/peripheral oxides (preserving poly-Si), BOE + KOH etching for front/edge poly-Si removal, and strong acid etching to strip both-side oxide layers.
ALD and Front/Back Films
In TOPCon cells, Al₂O₃ (via ALD) and SiNₓ films suppress rear surface recombination, increase Voc, and boost efficiency. SiNₓ also acts as an antireflective layer, reducing reflection and enhancing light absorption.
Related Products
Go to Product CenterScreen Printing
Screen printing applies metal paste (e.g., silver) to form electrodes, which are sintered at high temperatures to establish ohmic contact with the silicon substrate for current collection.
Optimizing gridline aspect ratio and spacing balances conductivity and optical performance. Reducing shading area risks higher contact resistance, necessitating careful trade-offs to maximize efficiency.
Related Products
Go to Product Center
Laser-Assisted Sintering (LAS)
By irradiating the cell with a high-intensity laser under a deflection voltage (≥10V), localized high-current sintering is induced. This triggers Ag-Si interdiffusion, drastically reducing contact resistance. Specially formulated pastes with low glass frit content minimize passivation layer damage while enabling superior ohmic contact. This method is now widely adopted in commercial TOPCon production.
Related Products
Go to Product CenterFast Delivery and Comprehensive Support
Provide end-to-end support from product to production line operation through on-site operation guidance and after-sales technical support.

































































